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Graduate Engineering Trainee
About the Company
At Koch, employees are empowered to do what they do best to make life better. Learn how our business philosophy helps employees unleash their potential while creating value for themselves and the company.
Job Description
As a Graduate Engineering Trainee, you will be an integral part of our Product Design and Development team, supporting Signal Integrity Activities for Customer and Product Design Engineers in Development of High-Speed Micro Connectors. We are part of the MSBU group, Specializing in the design and Manufacturing of High speed and Micro connectors for Consumer application. We focus on connectors like FPC, FFC, BB and IO connectors.
| Company Name | Koch companies |
|---|---|
| Role | Graduate Engineering Trainee |
| Location | Not specified |
| Salary | Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate’s knowledge, skills, abilities, and geographic location. |
| Job Type | Trainee |
Responsibilities
- Collaborate with Product Engineers to design and optimize high-speed micro interconnects using latest full-wave 3D EM filed solvers
- Use 3D field solvers like HFSS, SIwave etc to analyze the connector performance
- Generate signal integrity evaluation reports, qualification test reports, and other technical reports and presentations for both internal and customer use.
- Provide signal integrity advice to product management, sales, and customer regarding our interconnect products and application.
- Direct the PCB layout team to design signal integrity characterization test boards, and customer verification board.
- Stay updated on industry trends in high-speed connector requirements and share valuable insights within the team.
- Discover new techniques and methods in signal integrity modeling, design, analysis and verification.
Qualifications
- BE/BTech in Electrical/Electronic & Communication Engineering
- Fundamental knowledge of Electromagnetic Theory and Transmission Line Theory.
- Proficient in understanding Time Domain and Frequency domain.
- Basic understanding of High-speed standards like PCIe, USB, MIPI, DP, HDMI etc.
- Familiarity with 2D, 2.5D and 3D field solves like Ansys HFSS, SIwave, or other similar tools.
- Flexible and adaptable to organizational needs.
- Strong oral and written communication skills.
- Self-driven and eager to learn.
- Strong analytical thinking and problem-solving abilities.
- Alignment with MBM (Market-Based Management) philosophy.
Skills
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Frequently Asked Questions
You will be part of the Product Design and Development team, focusing on Signal Integrity activities for high-speed micro connectors, including types like FPC, FFC, BB, and IO connectors.
You will primarily be using 3D field solvers like HFSS and SIwave to analyze connector performance.
They are seeking candidates with a BE/BTech in Electrical/Electronic & Communication Engineering, fundamental knowledge of Electromagnetic and Transmission Line Theory, familiarity with high-speed standards, and experience with 2D/3D field solvers. Strong communication and problem-solving skills are also essential.
Yes, the actual compensation for this role can vary depending on the candidate’s knowledge, skills, abilities, and geographic location.
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How to Apply
- Review Job Details: Read through all the job details on this page to understand the requirements and responsibilities.
- Click the Apply Link: Scroll down and click the “Apply Link” button to be redirected to the official website.
- Fill Out the Application: On the official website, fill out the application form with the provided information.
- Double-Check Your Information: Before submitting your application, review all the details you’ve provided to ensure accuracy and completeness.
- Submit Your Application: Once you’re satisfied with your application, submit it through the official website as instructed.
